Cooler Master ThermalFusion 400 4g
- High Thermal Conductivity
- Low Thermal Resistance
- Non-Curing
- Non-Corrosive
- Easy Application with Included Razor Blade
ThermalFusion 400 is a supreme thermal compound that includes high thermal conductivity with low thermal resistance. Its non-curing and non-electrical conductive traits can avoid any short circuit incidence. ThermalFusion 400 is the ultimate solution for thermal dissipation to improve CPU, GPU cooling and other bonding applications.
Color Gray
Specific Gravity 3.5
Thermal Conductivity 2.89 (W/m-K)
Volume Resistivity 2.0E+10 (ohm-cm)
Thermal Resistance 0.032 (Ž-cm²/W)
BLT (Bond Line Thickness) 0.008 (mm)
Volatile content <0.1 (%)
Net Weight (g) 4
ThermalFusion 400 is a supreme thermal compound that includes high thermal conductivity with low thermal resistance. Its non-curing and non-electrical conductive traits can avoid any short circuit incidence. ThermalFusion 400 is the ultimate solution for thermal dissipation to improve CPU, GPU cooling and other bonding applications.
Color Gray
Specific Gravity 3.5
Thermal Conductivity 2.89 (W/m-K)
Volume Resistivity 2.0E+10 (ohm-cm)
Thermal Resistance 0.032 (Ž-cm²/W)
BLT (Bond Line Thickness) 0.008 (mm)
Volatile content <0.1 (%)
Net Weight (g) 4